EMBEDDED/PORTABLE PROCESSING SOLUTIONS

Signal Data Processor (SDP)
Portable MAPstation™ Systems
Custom Embedded Solutions

 

Signal Data Processor (SDP)

The SRC® Signal Data Processor (SDP) is available with either air or liquid based cooling systems and can contain a mix of up to 10 MAP® processors and shared Common Memory modules along with a dual-socket commodity motherboard. The peak single precision floating point performance of a 10 MAP processor system is 240 GFlops. 

This general purpose computer system is well suited to applications such as: 

  • Real-time Synthetic Aperture Radar (SAR) processing
  • Real-time image processing

 

Air-Cooled SDP Liquid-Cooled SDP

 

Features & Benefits

  • Significant volume, weight and power savings through the use of a single MAP processor and an IA microprocessor DEL/DLD combination to replace dozens of microprocessors.
  • Powerful processing in two cooling variants:
    • Air-cooled SDP – a 19” rack-mountable air-cooled variant that uses standard front to back ambient air flow; ideal for use in pressurized aircraft or laboratory environments; available in either SRC-6 or SRC-7 designs. 
    • Liquid-cooled SDP – a sealed chassis that utilizes a combination of localized liquid cold plates and a recirculated air loop which are both connected to an external liquid-to-air heat exchanger; intended for use in high altitude unpressurized environments; currently available in SRC-6 design (SRC-7 design is under development).
  • Can be used in Unmanned Aerial Vehicle (UAV), Unmanned Ground Vehicle (UGV), traditional military aircraft, helicopter, or ground-based applications. 
  • Utilizing Carte™ software tools, the Signal Data Processors are compatible with all other SRC products.

 

More Information

Download product sheet

 

How to Buy

 

Signal Data Processor Specifications

 Feature

Liquid-Cooled

Air-Cooled
Microprocessor Compliment
     Microprocessor motherboard Dual 3 GHz EM64T Xeon Dual 3 GHz EM64T Xeon
     Microprocessor memory      6 Gbytes DDR SDRAM 6 Gbytes DDR SDRAM
SRC Module Compliment
    Number of module slots 10 10
     MAP® processors Up to 5 Series E MAP modules  Up to 10 Series E MAP modules 
     Common Memory Up to 6 Series B 16 Gbyte Common Memory modules Up to 10 Series B 16 Gbyte Common Memory modules
Internal Module Interconnect
     Topology Crossbar using SRC Series B Hi-Bar® switch (view Hi-Bar specs) Crossbar using SRC Series B Hi-Bar switch (view Hi-Bar specs)
     Sustained Bandwidth 1.4 Gbytes/s payload bandwidth per port 1.4 Gbytes/s payload bandwidth per port
External I/O Serial FPDP, Gigabit Ethernet 
(for alternative I/O contact SRC)		 Serial FPDP, Gigabit Ethernet 
(for alternative I/O contact SRC)
Data Storage
     Removable Disk Up to 1 TB NIST Certified 256 bit AES 
hardware encrypted		 Up to 1 TB NIST Certified 256 bit AES
hardware encrypted
     Solid State Disk Up to 128 GB Up to 128 GB
Mechanical
     Dimension  21” W x 17”D x 10.5”H 17” W x 27”D x 10.5”H
     Weight (4 MAP, 5 Common
     Memory configuration)		 78.5 pounds 88 pounds
     Power (4 MAP, 5 Common
     Memory configuration		 <1050 W, 37.5A @ 28VDC MIL STD 704 compliant 100VAC - 240VAC, 12A - 5A 
(for alternative voltages contact SRC)
     Cooling Methodology Localized cold plates & closed loop air Air
Operating Conditions
     Temperature  -55oC to +49oC 0oC to +49oC 
     Altitude 25,000 ft. min. (for up to 50K ft contact SRC) 10,000 ft
     Shock RTCA-DO-160E 6g/11ms sawtooth RTCA-DO-160E 6g/11ms sawtooth available
     Vibration RTCA-DO-160E Cat. S Curve M RTCA-DO-160E Cat. S Curve M available
     Sand and Dust MIL-STD-810E 510.3  
     Conducted Emissions MIL-STD-461E CE101, CE102  
     Radiated Susceptibility MIL-STD-461E RS103  
     Conducted Susceptibility RTCA-DO-160E CS101MIL-STD-461E CS114, CS115, CS116  
     Radiated Emissions MIL-STD-461E RE102  
     Humidity  RTCA-DO-160E Cat. B 0-100% condensing  
     Explosive Atmosphere MIL-STD-810E 511.3  
Non-Operational Conditions
     Temperature -40oC to +71oC (for alternative temperature ranges contact SRC) -40oC to +71oC
     Crash Safety Acceleration +-9g  
     Crash Safety Shock RTCA-DO-160E 20g/11ms sawtooth  

 

SRC Computers reserves the right to update or change these specifications at any time.

 

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Portable MAPstation™ Systems

 

Rugged Sealed Enclosure
(weights less than 9 lbs.)		 Lightweight Enclosure
(weighs less than 5 lbs.)

 

SRC® Portable MAPstation™ systems are miniaturized mobile/portable computer systems based on SRC Computers’ IMPLICIT+EXPLICIT™ Architecture and reconfigurable MAP® processor and are software compatible with all other SRC products. Ruggedized models have up to 12 Gbytes per second of direct sensor I/O bandwidth in a single processor and weigh less than nine pounds while using only 20 watts of power for typical applications. Lightweight models offer the same levels of performance in a package weighing less than five pounds.

 

Initially targeted at unmanned aerial vehicle (UAV) and embedded applications, typical applications for Portable MAPstation systems include:

  • Real-time SAR image processing
  • Real-time target recognition by forward air observers
  • Real-time biometric recognition by security personnel
  • General-purpose high performance computation

 

Features & Benefits

  • Powerful MAP processing in two small form-factors for real-time, compute-intensive processing:
    • Rugged Sealed Enclosure – has up to 12 Gbytes per second of direct sensor I/O bandwidth in a single processor, weighs less than 9 pounds and uses only 20 watts of power 
    • Lightweight Enclosure – offers the same levels of performance in a package weighing less than 5 pounds.
  • Can be used in mobile, airborne or ground-based applications. 
  • Utilizing Carte™ software tools, Portable MAPstation systems are compatible with all other SRC products.

 

More Information

 

Portable MAPstation™ Specifications

CPU

Intel 1.6 GHz Atom Processor, Z530

     Front Side Bus

533 MHz

     Cache

L1 32 KB instruction / 24 KB data cache, 512 KB L2 advanced transfer cache

     FLOPS

2.92 GFLOPS theoretical peak performance (@1.46 GHz)

     CPU Memory

2 GB DDR2 533

     Memory Bandwidth

4.2 GB/s

Microprocessor to MAP Interconnect

Patented SNAP™ memory interconnect to the MAP® processor
3.6 GB/s interconnect payload bandwidth per port SNAP-to-MAP
4.2 GB/s aggregate payload bandwidth between SNAP and MAP

MAP Processor

Series H MAP Processor; five stuffing options available

Enclosure Type

Standard Sealed Enclosure

Lightweight Enclosure

External I/O

Serial

2-USB 2.0

2-USB 2.0

Network

1-Gigabit Ethernet

1 -Gigabit Ethernet

Video

1-HDMI

1-HDMI

Peripheral Cards Slot

1-XMC card slot
(VITA 42.3, PCIe X1 lane)

1-XMC card slot
(VITA 42.3, PCIe X1 lane)

MAP GPIOX Card Slot

1-GPIOX card slot

1-SDHC card slot
1-GPIOX card slot

Physical Dimensions

Dimensions

Height: 3.5 in. (8.89 cm)
Width: 7.5 in. (19.05 cm)
Depth: 10.0 in. (25.40 cm)

Height: 3.0 in. (7.62 cm)
Width: 6.0 in. (15.24 cm)
Depth: 9.0 in. (22.86 cm)

Construction

Sealed enclosure

Flow through enclosure

Volume

262.5 cu in. (4.3 liters)

162 cu in. (2.65 liters)

Weight

<9 lbs (4 kg)

<5 lbs (2.3 kg)

Cooling

Forced air conduction cooled

Fan-based convection cooled

Operating Ambient Temperature w/HDD

40o to 130o F (+5o to 55o C)

40o to 130o F (+5o to 55o C)

Operating Ambient Temperature w/SDD

-40o to 150o F (-40o to 65o C)

-40o to 150o F (-40o to 65o C)

Non-Operating
Temperature w/HDD

-5o to 150o F (-20o to 65o C)

-5o to 150o F (-20o to 65o C)

Non-Operating
Temperature w/SDD

-20o to 175o F (-30o to 60o C)

-20o to 175o F (-30o to 60o C)

Operating Relative Humidity

0 to 100% condensing

20 to 80% non-condensing

Altitude

>30,000 ft

10,000 ft

MTBF (Khours)

TBD

Operating System

Fedora Linux

File Systems

ext3

Compilers

Intel C++, Intel Fortran, SRC Carte™ Programming Environment

Power

+12 VDC (+2V/-1V), 20 W typical

 

SRC Computers reserves the right to update these specifications at any time.

 

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Custom Embedded Solutions

SRC Computers offers embedded solutions that can be customized to specific needs and environments. For benign environments, standard SRC® MAP® processors can be mounted on a variety of carrier boards and mated with 6U microprocessors. For more hostile environments, SRC Computers has partnerships with world leaders in advanced cooling and packaging, which allow us to offer a variety of custom and semi-custom packaging options.

Features & Benefits

  • Significant volume, weight and power savings through the use of a single MAP processor and an IA microprocessor DEL/DLD combination to replace dozens of microprocessors
  • In addition to its superior interconnect bandwidth via SNAP™  interconnect, each MAP processor also sustains 4800 MBytes/s of sensor I/O bandwidth that connects directly to the user chips
  • Through the use of the SRC Carte™ Programming Environment, SRC embedded systems are fully software-compatible with all other SRC products
  • SRC embedded systems can be deployed in mobile, airborne and shipborne environments

 

Contact an SRC representative with your application needs or for more information.

 

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