EMBEDDED/PORTABLE PROCESSING SOLUTIONS

Signal Data Processor (SDP)
Portable MAPstation™ Systems
Custom Embedded Solutions

 

Signal Data Processor (SDP)

The SRC® Signal Data Processor (SDP) is available with either air or liquid based cooling systems and can contain a mix of up to 10 MAP® processors and shared Common Memory modules along with a dual-socket commodity motherboard. The peak single precision floating point performance of a 10 MAP processor system is 240 GFlops. 

This general purpose computer system is well suited to applications such as: 

  • Real-time Synthetic Aperture Radar (SAR) processing
  • Real-time image processing

 

Air-Cooled SDP Liquid-Cooled SDP

 

Features & Benefits

  • Significant volume, weight and power savings through the use of a single MAP processor and an IA microprocessor DEL/DLD combination to replace dozens of microprocessors.
  • Powerful processing in two cooling variants:
    • Air-cooled SDP – a 19” rack-mountable air-cooled variant that uses standard front to back ambient air flow; ideal for use in pressurized aircraft or laboratory environments; available in either SRC-6 or SRC-7 designs. 
    • Liquid-cooled SDP – a sealed chassis that utilizes a combination of localized liquid cold plates and a recirculated air loop which are both connected to an external liquid-to-air heat exchanger; intended for use in high altitude unpressurized environments; currently available in SRC-6 design (SRC-7 design is under development).
  • Can be used in Unmanned Aerial Vehicle (UAV), Unmanned Ground Vehicle (UGV), traditional military aircraft, helicopter, or ground-based applications. 
  • Utilizing Carte software tools, the Signal Data Processors are compatible with all other SRC products.

 

More Information

Download product sheet

 

How to Buy

 

Signal Data Processor Specifications

 Feature

Liquid-Cooled

Air-Cooled

Microprocessor Compliment
     Microprocessor motherboard Dual 3 GHz EM64T Xeon Dual 3 GHz EM64T Xeon
     Microprocessor memory      6 Gbytes DDR SDRAM 6 Gbytes DDR SDRAM
SRC Module Compliment
    Number of module slots 10 10
     MAP® processors Up to 5 Series E MAP modules  Up to 10 Series E MAP modules 
     Common Memory Up to 6 Series B 16 Gbyte Common Memory modules Up to 10 Series B 16 Gbyte Common Memory modules
Internal Module Interconnect
     Topology Crossbar using SRC Series B Hi-Bar® switch (view Hi-Bar specs) Crossbar using SRC Series B Hi-Bar switch (view Hi-Bar specs)
     Sustained Bandwidth 1.4 Gbytes/s payload bandwidth per port 1.4 Gbytes/s payload bandwidth per port
External I/O Serial FPDP, Gigabit Ethernet 
(for alternative I/O contact SRC)
Serial FPDP, Gigabit Ethernet 
(for alternative I/O contact SRC)
Data Storage
     Removable Disk Up to 1 TB NIST Certified 256 bit AES 
hardware encrypted
Up to 1 TB NIST Certified 256 bit AES
hardware encrypted
     Solid State Disk Up to 128 GB Up to 128 GB
Mechanical
     Dimension  21” W x 17”D x 10.5”H 17” W x 27”D x 10.5”H
     Weight (4 MAP, 5 Common
     Memory configuration)
78.5 pounds 88 pounds
     Power (4 MAP, 5 Common
     Memory configuration
<1050 W, 37.5A @ 28VDC MIL STD 704 compliant 100VAC - 240VAC, 12A - 5A 
(for alternative voltages contact SRC)
     Cooling Methodology Localized cold plates & closed loop air Air
Operating Conditions
     Temperature  -55oC to +49oC 0oC to +49o
     Altitude 25,000 ft. min. (for up to 50K ft contact SRC) 10,000 ft
     Shock RTCA-DO-160E 6g/11ms sawtooth RTCA-DO-160E 6g/11ms sawtooth available
     Vibration RTCA-DO-160E Cat. S Curve M RTCA-DO-160E Cat. S Curve M available
     Sand and Dust MIL-STD-810E 510.3  
     Conducted Emissions MIL-STD-461E CE101, CE102  
     Radiated Susceptibility MIL-STD-461E RS103  
     Conducted Susceptibility RTCA-DO-160E CS101MIL-STD-461E CS114, CS115, CS116  
     Radiated Emissions MIL-STD-461E RE102  
     Humidity  RTCA-DO-160E Cat. B 0-100% condensing  
     Explosive Atmosphere MIL-STD-810E 511.3  
Non-Operational Conditions
     Temperature -40oC to +71oC (for alternative temperature ranges contact SRC) -40oC to +71oC
     Crash Safety Acceleration +-9g  
     Crash Safety Shock RTCA-DO-160E 20g/11ms sawtooth  

 

SRC Computers reserves the right to update or change these specifications at any time.

 

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Portable MAPstation Systems

 

Rugged Sealed Enclosure
(weights less than 9 lbs.)
Lightweight Enclosure
(weighs less than 5 lbs.)

 

SRC® Portable MAPstationsystems are miniaturized mobile/portable computer systems based on SRC Computers’ IMPLICIT+EXPLICIT Architecture and reconfigurable MAP® processor and are software compatible with all other SRC products. Ruggedized models have up to 12 Gbytes per second of direct sensor I/O bandwidth in a single processor and weigh less than nine pounds while using only 20 watts of power for typical applications. Lightweight models offer the same levels of performance in a package weighing less than five pounds.

 

Initially targeted at unmanned aerial vehicle (UAV) and embedded applications, typical applications for Portable MAPstation systems include:

  • Real-time SAR image processing
  • Real-time target recognition by forward air observers
  • Real-time biometric recognition by security personnel
  • General-purpose high performance computation

 

Features & Benefits

  • Powerful MAP processing in two small form-factors for real-time, compute-intensive processing:
    • Rugged Sealed Enclosure – has up to 12 Gbytes per second of direct sensor I/O bandwidth in a single processor, weighs less than 9 pounds and uses only 20 watts of power 
    • Lightweight Enclosure – offers the same levels of performance in a package weighing less than 5 pounds.
  • Can be used in mobile, airborne or ground-based applications
  • Utilizing Carte software tools, Portable MAPstation systems are compatible with all other SRC products.

 

More Information

 

Portable MAPstation Specifications

CPU

Intel 1.6 GHz Atom Processor, Z530

     Front Side Bus

533 MHz

     Cache

L1 32 KB instruction / 24 KB data cache, 512 KB L2 advanced transfer cache

     FLOPS

2.92 GFLOPS theoretical peak performance (@1.46 GHz)

     CPU Memory

2 GB DDR2 533

     Memory Bandwidth

4.2 GB/s

Microprocessor to MAP Interconnect

Patented SNAP™ memory interconnect to the MAP® processor
3.6 GB/s interconnect payload bandwidth per port SNAP-to-MAP
4.2 GB/s aggregate payload bandwidth between SNAP and MAP

MAP Processor

Series H MAP Processor; five stuffing options available

Enclosure Type

Standard Sealed Enclosure

Lightweight Enclosure

External I/O

Serial

2-USB 2.0

2-USB 2.0

Network

1-Gigabit Ethernet

1 -Gigabit Ethernet

Video

1-HDMI

1-HDMI

Peripheral Cards Slot

1-XMC card slot
(VITA 42.3, PCIe X1 lane)

1-XMC card slot
(VITA 42.3, PCIe X1 lane)

MAP GPIOX Card Slot

1-GPIOX card slot

1-SDHC card slot
1-GPIOX card slot

Physical Dimensions

Dimensions

Height: 3.5 in. (8.89 cm)
Width: 7.5 in. (19.05 cm)
Depth: 10.0 in. (25.40 cm)

Height: 3.0 in. (7.62 cm)
Width: 6.0 in. (15.24 cm)
Depth: 9.0 in. (22.86 cm)

Construction

Sealed enclosure

Flow through enclosure

Volume

262.5 cu in. (4.3 liters)

162 cu in. (2.65 liters)

Weight

<9 lbs (4 kg)

<5 lbs (2.3 kg)

Cooling

Forced air conduction cooled

Fan-based convection cooled

Operating Ambient Temperature w/HDD

40o to 130o F (+5o to 55o C)

40o to 130o F (+5o to 55o C)

Operating Ambient Temperature w/SDD

-40o to 150o F (-40o to 65o C)

-40o to 150o F (-40o to 65o C)

Non-Operating
Temperature w/HDD

-5o to 150o F (-20o to 65o C)

-5o to 150o F (-20o to 65o C)

Non-Operating
Temperature w/SDD

-20o to 175o F (-30o to 60o C)

-20o to 175o F (-30o to 60o C)

Operating Relative Humidity

0 to 100% condensing

20 to 80% non-condensing

Altitude

>30,000 ft

10,000 ft

MTBF (Khours)

TBD

Operating System

Fedora Linux

File Systems

ext3

Compilers

Intel C++, Intel Fortran, SRC Carte Programming Environment

Power

+12 VDC (+2V/-1V), 20 W typical

 

SRC Computers reserves the right to update these specifications at any time.

 

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Custom Embedded Solutions

SRC Computers offers embedded solutions that can be customized to specific needs and environments. For benign environments, standard SRC® MAP® processors can be mounted on a variety of carrier boards and mated with 6U microprocessors. For more hostile environments, SRC Computers has partnerships with world leaders in advanced cooling and packaging, which allow us to offer a variety of custom and semi-custom packaging options.

Features & Benefits

  • Significant volume, weight and power savings through the use of a single MAP processor and an IA microprocessor DEL/DLD combination to replace dozens of microprocessors
  • In addition to its superior interconnect bandwidth via SNAP™  interconnect, each MAP processor also sustains 4800 MBytes/s of sensor I/O bandwidth that connects directly to the user chips
  • Through the use of the SRC Carte Programming Environment, SRC embedded systems are fully software-compatible with all other SRC products
  • SRC embedded systems can be deployed in mobile, airborne and shipborne environments

 

Contact an SRC representative with your application needs or for more information.

 

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